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Sputtering deposition equipment - List of Manufacturers, Suppliers, Companies and Products

Sputtering deposition equipment Product List

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RAM cluster-type sputtering deposition device

There are five expansion slots, allowing for additional installation of sputter chambers, deposition devices, glove boxes, etc.

The RAM cluster sputtering system is a cluster-type sputtering device equipped with RAM cathodes (four-sided low-damage sputtering cathodes). To avoid damaging the underlying layer, the initial layer is deposited using low-damage sputtering with the RAM cathode. It has five expansion slots, allowing for the addition of sputtering chambers, deposition devices, glove boxes, and more. Additionally, it is equipped with a 25-stage multi-tier load lock, enabling automatic deposition of a wide variety of film recipes for each slot, making it suitable for all kinds of research and development.

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Custom-made sputtering deposition equipment

Difficult materials, various substrate shapes, and applications! Capable of accommodating a very wide range of substrate sizes.

We offer a "custom-made sputtering deposition system (PVD)" that can handle everything from research and prototyping to mass production. We support coating for decorative and surface protection purposes, as well as research and development to mass production of thin film devices such as flexible electronics, optical communication technologies, thin film solar cells, and batteries. We can assemble the system according to your needs, including sample size, deposition target materials, and batch processes. 【Features】 - Unique technology that accommodates all metal and oxide targets - Wafer sizes from 1mm x 1mm to 300mm x 560mm, with thicknesses up to 25mm - No need for hardware or software changes for deposition on different sizes - Thin Film Equipment recommended by research institutions across Europe *You can download the English version of the materials. For more details, please feel free to contact us.

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Ion Assist Sputtering Deposition Equipment

For engineers in the wear-resistant coating industry! Precise control of film stress.

We offer an "Ion Assist Sputtering Deposition System (PVD)" that can handle everything from research and development to small-scale production. This system can be applied to a wide range of fields, including semiconductor devices, nanotechnology, ferroelectric and ferromagnetic thin films, and superconducting thin films. In particular, as an alternative technology to bias sputtering, it achieves dense and highly adherent thin film deposition, making it easy to control film stress. Furthermore, it supports high-temperature deposition up to a maximum substrate temperature of 800°C, and deposition on insulating substrates is also possible. 【Features】 - Provides dense and highly adherent thin films due to the high-temperature substrate heating mechanism and ion assist effect. - Wafer carrier with excellent thermal conductivity. - Supports alloy deposition and deposition of oxides and nitrides via reactive sputtering. - Uses an end-hole type (Kaufman type) ion source with strong directionality and concentrated ion energy bandwidth. - Accommodates lab-scale to small-scale production, delivering thin films with excellent density and adhesion. *For more details, please feel free to contact us.

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RAM inline sputtering deposition system

It is a device that can be transitioned from a pilot line to a mass production line.

This is a deposition-up horizontal inline sputtering device equipped with RAM cathodes (four-sided opposing low-damage sputtering cathodes) and strong magnetic field planar cathodes. To avoid damaging the underlying layer, the initial layer is deposited using the RAM cathode with low-damage sputtering. After that, high-speed deposition is performed using the strong magnetic field cathode. Each of the load lock stockers and unload lock stockers is vacuum-stored with 15 trays. *For more details, please refer to the PDF document or feel free to contact us.*

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